Number of found documents:
1
Published from
to
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Dušek, Karel; Bušek, D.
2016 - English
Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads.
These residues may have non-conductive character and therefore in-circuit test may mark tested product as
failed though they would have worked normally. Since it is not possible to export such marked products, the
total production quality decreases. In thiswork,we analyze the realmanufacturing problemusing Energy Dispersive
Spectroscopy (EDS) analysis of the stains with the aim to find the possible source of residues that appear on
the testing pads during the mass electronic assembly or during Printed Circuit Board (PCB) production. Analysis
of potential source of residues together with its diagnostic and confirmation of its source is presented in this
work.
Keywords:
Assembly manufacturing; Flux spattering; In-circuit test; Reliability; Scanning electron microscopy; Soldering
Available at various departments of the ČVUT.
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark ...
NRGL provides central access to information on grey literature produced in the Czech Republic in the fields of science, research and education. You can find more information about grey literature and NRGL at service web
Send your suggestions and comments to nusl@techlib.cz
Provider
Other bases