Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Dušek, Karel; Bušek, D.
2016 - anglický Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed though they would have worked normally. Since it is not possible to export such marked products, the total production quality decreases. In thiswork,we analyze the realmanufacturing problemusing Energy Dispersive Spectroscopy (EDS) analysis of the stains with the aim to find the possible source of residues that appear on the testing pads during the mass electronic assembly or during Printed Circuit Board (PCB) production. Analysis of potential source of residues together with its diagnostic and confirmation of its source is presented in this work. Klíčová slova: Assembly manufacturing; Flux spattering; In-circuit test; Reliability; Scanning electron microscopy; Soldering Plné texty jsou dostupné na jednotlivých katedrách ČVUT. Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis

Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark ...

Dušek, Karel; Bušek, D.
České vysoké učení technické v Praze, 2016

Na jiné půdě. Růst v umění, společnosti a kultuře
Šejn, Miloš
2011 - český Klíčová slova: růst; umění Plné texty jsou dostupné v digitálním repozitáři NUŠL Na jiné půdě. Růst v umění, společnosti a kultuře

Šejn, Miloš
Akademie výtvarných umění, 2011