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Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Dušek, Karel; Bušek, D.
2016 - anglický
Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads.
These residues may have non-conductive character and therefore in-circuit test may mark tested product as
failed though they would have worked normally. Since it is not possible to export such marked products, the
total production quality decreases. In thiswork,we analyze the realmanufacturing problemusing Energy Dispersive
Spectroscopy (EDS) analysis of the stains with the aim to find the possible source of residues that appear on
the testing pads during the mass electronic assembly or during Printed Circuit Board (PCB) production. Analysis
of potential source of residues together with its diagnostic and confirmation of its source is presented in this
work.
Klíčová slova:
Assembly manufacturing; Flux spattering; In-circuit test; Reliability; Scanning electron microscopy; Soldering
Plné texty jsou dostupné na jednotlivých katedrách ČVUT.
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark ...
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